Select Page

Hiden Analytical will be exhibiting at the 18th International Symposium on Sputtering & Plasma Processes, taking place 30 June-3 July 2026 at Kyoto Research Park in Kyoto, Japan. Representing us will be Yoshiaki Watanabe and Hayato Tanaka of Innovation Science, our Japanese agents, they will be onsite to support your plasma processing needs. 

The 18th International Symposium on Sputtering & Plasma Processes (ISSP2026) is positioned as a specialist forum for intensive discussion of current advances in sputtering and plasma processing, with emphasis on both fundamental science and application-driven process engineering. Its program spans core topics including sputtering and plasma-process fundamentals, smart process technologies, pulsed sputtering and HiPIMS, thin-film growth mechanisms, functional thin films and advanced coatings, and broader industrial applications. 


What to Expect?

  • A technically focused program centred on the latest advances in sputtering and plasma processing, framed around the symposium theme of advancing these technologies for a connected future.
  • Coverage of the field’s core scientific and engineering priorities, including sputtering and plasma-process fundamentals, smart process technologies, pulsed sputtering and HiPIMS, thin-film growth, functional thin films, advanced coatings, and applied industrial research.
  • Technical exchange and intensive discussion of current topics and trends across sputtering and plasma processes.
  • Speakers presenting in the poster session as well as opportunities for detailed one-to-one conversations on mechanisms, process optimization, and data interpretation.
  • A strong balance between academic depth and industrial relevance, supported by a program committee drawn mainly from related industries and by an exhibition running alongside the technical program. 

Hiden Analytical at ISSP 2026:

  • Meet Yoshiaki Watanabe and Hayato Tanaka of Innovation Science, our Japanese partners. to discuss thin-film, plasma, and surface-engineering workflows.
  • Attendees can explore analytical approaches that support deeper understanding of plasma-phase chemistry, vacuum-process stability, thin-film deposition conditions, and surface-interaction effects in advanced coating and sputtering environments.
  • Seek better in situ and vacuum-based diagnostics for process development, troubleshooting, and scale-up in sputtering and plasma applications.

📅 Event Dates: 30 June-3 July, 2026.
📍 Location: Kyoto Research Park, Kyoto, Japan.
🔗 Event Website: 18th International Symposium on Sputtering & Plasma Processes. 


We look forward to connecting with the plasma community, and to discussing how high-sensitivity analytical instrumentation can strengthen process insight and decision-making in demanding deposition environments. 

🔍 Explore more about our upcoming exhibitions & conferences.